Circuit board assembly

ABSTRACT

A circuit board assembly includes a circuit board, an electronic component, a plurality of incremental detents and at least one projection. The plurality of incremental detents are coupled to one of the circuit board and the electronic component and are retained relative to said one of the circuit board and the electronic component against linear movement in both directions along a first axis. The at least one projection is coupled to the other of the circuit board and the electronic component and is retained against linear movement along the first axis. The at least one projection is received within at least one of the plurality of detents to retain the electronic component relative to the circuit board against linear movement in both directions along the axis.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

The present application is related to co-pending U.S. patent applicationSer. No. 10/680,445 filed on the same date herewith by Stephan K.Barsun, Gregory S. Meyer, Bryan D. Bolich and S. Daniel Cromwellentitled “Circuit Board Assembly,” the full disclosure of which ishereby incorporated by reference.

BACKGROUND OF THE INVENTION

Computing and electronic devices, such as servers, typically include atleast one circuit board, a frame supporting the circuit board and aplurality of electronic components, such as processor components,connected to the circuit board. Many electronic components include aheat sink for dissipating generated heat. The electronic component istypically electrically connected to the circuit board utilizing a pinand socket arrangement. To retain the pins and sockets connecting theelectronic component to the circuit board in proper position duringdynamic loading and vibration normally experienced by such devices,additional fasteners are employed to further secure the electroniccomponent to the circuit board. Ordinarily, such fasteners comprisethreaded bolts which pass through clearance holes in the heat sink andwhich are threaded or screwed into the frame or into standoffs adheredto the frame.

The pin and socket arrangements typically require precisely controlledspacing to ensure that the pins are properly engaged within the sockets.Unfortunately, standard manufacturing variations or tolerances preventachieving such precise control over the spacing between the electroniccomponent and the circuit board. The same manufacturing variationsfurther impede the proper alignment of the fasteners with the threadedportions of the frame or the threaded standoffs. Such misalignmentfurther increases the likelihood of accidental damage to the fragilesolder joints of the pin and socket arrangements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side elevational view schematically illustrating an exampleof one embodiment of a circuit board assembly of the present invention.

FIG. 2 is a side elevational view schematically illustrating a firstalternative embodiment of the circuit board assembly of FIG. 1.

FIG. 3 schematically illustrates a computing device incorporating asecond alternative embodiment of the circuit board assembly of FIG. 1.

FIG. 4 is a top perspective view of a processor system of the computerdevice of FIG. 3 incorporating the third alternative embodiment of thecircuit board assembly of FIG. 1, with portions omitted for purposes ofillustration.

FIG. 5 is a partially exploded perspective view of the processor systemof FIG. 4.

FIG. 6 is an enlarged fragmentary perspective view of the processorsystem of FIG. 4.

FIG. 7 is a fragmentary exploded perspective view of a support assemblyof the processor system of FIG. 6.

FIG. 7A is a fragmentary side elevational view of the processor systemof FIG. 6.

FIG. 8 is a sectional view of the processor system of FIG. 6 taken alongline 8—8.

FIG. 9 is a fragmentary sectional view of the processor system of FIG. 6taken along line 9—9.

DETAILED DESCRIPTION OF THE EXAMPLE EMBODIMENTS

FIG. 1 is a side elevational view schematically illustrating circuitboard assembly 20. Circuit board assembly 20 generally includes circuitboard 22, frame 24, electronic component 26, connector portion 28,connector portion 30 and electronic component support system 32. Circuitboard 22 comprises a conventionally known or future developed circuitboard configured to transmit signals to and from various componentsconnected to circuit board 22. Such components may be permanentlysecured to circuit board 22, such as resistors, capacitors and the like.Other components may be releasably connected to circuit board 22.

Frame 24 comprises a generally rigid structure extending adjacentcircuit board 22. Frame 24 rigidifies and supports frame 24. Frame 24further supports portions of support system 32. In alternativeembodiments, frame 24 may be omitted when support system 32 is directlyconnected to circuit board 22 or to other structures mounted to circuitboard 22.

Electronic component 26 comprises an electronic component configured tobe releasably connected to circuit board 22. In one embodiment,electronic component 26 may comprise a circuit board connected tocircuit board 22. In another embodiment, electronic component 26 maycomprise an active component such as an integrated circuit orsemiconductor device directly or indirectly connected to circuit board22. For example, component 26 may include an integrated circuit directlyconnected to a connector which is connected to printed circuit board 22or may comprise an integrated circuit connected to a circuit board whichis connected to a connector connected to printed circuit 22. Theintegrated circuit may also be connected to other structures in additionto circuit board 22. For example, electronic component 26 may include anintegrated circuit, such as a processor 34, connected to a heat sink 36.The electronic component 26 may also include a power supply (not shown)for supplying power to the processor 34.

Connector portions 28 and 30 engage and connect with one another toconnect electronic component 26 to circuit board 22 so as to transmitsignals to and from electronic component 26 and circuit board 22. In oneembodiment, connector portion 28 may include a plurality of sockets,while connector portion 30 includes a plurality of pins configured to bereceived within the plurality of sockets. In yet another embodiment,connector portion 28 may include a plurality of sockets, while connectorportion 30 includes a plurality of pins. In still other embodiments,connector portions 28 and 30 may comprise other conventionally known orfuture developed devices for connecting electronic component 26 tocircuit board 22 and for transmitting signals in at least one directionbetween electronic component 26 and circuit board 22.

Electronic component support system 32 supports or assists in supportingand retaining an electronic component 26 relative to circuit board 22 tocontrol the spacing between electronic component 26 and circuit board22. As a result, support system 32 assists in appropriately supportingconnector portions 28 and 30 relative to one another. Support system 32generally includes support structure 38 and support structures 40.

Support structure 38 is coupled to circuit board 22 and extends along anaxis 42 generally perpendicular to circuit board 22. For purposes ofthis disclosure, the term “coupled” shall mean the joining of twomembers directly or indirectly to one another. Such joining may bestationary in nature or movable in nature. Such joining may be achievedwith the two members or the two members and any additional intermediatemembers being integrally formed as a single unitary body with oneanother or with the two members or the two members and any additionalintermediate member being attached to one another. Such joining may bepermanent in nature or alternatively may be removable or releasable innature.

In the particular embodiment illustrated, structure 38 is indirectlycoupled to circuit board 22 by frame 24. Support structure 38 is coupledto frame 24 such that support structure 38 is retained against linearmovement in both directions along axis 42. In one embodiment, supportstructure 38 may be integrally formed as part of a single unitary bodywith frame 24. In another embodiment, support structure may be welded,bonded, fastened or pressed to frame 24.

Support structure 38 includes a plurality of detents 46 incrementallyspaced from one another along axis 42. Although schematicallyillustrated as notches, detents 46 may have a variety of differentconfigurations so as to receive and engage portions of support structure40. For example, detents 46 may alternatively comprise annular grooves,depressions, bores and the like.

Coupling structures 40 comprise one or more members that are coupled toelectronic component 26 to form an electronic component mounting unit49. Structures 40 are retained against linear movement along axis 42relative to electronic component 26. Coupling structures 40 includedetent-engaging projections 50 which are configured to be receivedwithin detents 46. Projections 50 mate or fit within detents 46 so as toengage both an upper and a lower surface of a receiving detent to secureand retain electronic component 26 relative to circuit board 22 in bothdirections along axis 42. As a result, projections 50 interact withdetents 46 to precisely position electronic component 26 and connectorportion 30 relative to circuit board 22 and connector portion 28.

To accommodate different spacings between the electronic component 26and circuit board 22 due to varying tolerances of other structuresconnecting component 26 and circuit board 22, projections 50 are movablysupported for movement between a detent-engaging position in whichprojections 50 extend into one or more of detents 46 and a withdrawnposition in which projections 50 are removed from one or more of detents46. In the particular embodiment illustrated, structures 40 arepivotally coupled to electronic component 26 for pivotal movement aboutaxes 52. In one embodiment, structures 40 are resiliently biased towardsthe detent-engaging positions. Such bias may be provided by springs orother biasing mechanisms. For example, a torsion spring may be coupledbetween electronic component 26 and structure 40 to resiliently biasstructures 40 towards the detent-engaging positions.

Although system 32 is illustrated as having structure 38 including threedetents 46, structure 38 may be provided with a multitude of uniformlyor variably spaced detents 46 along axis 42. Although system 32 isillustrated as including two coupling structures 40, system 32 mayalternatively include a fewer or greater number of coupling structures40. Although projections 50 are illustrated as extending towards oneanother on the exterior of structure 38, projections 50 mayalternatively extend outward away from one another within an interiorcavity of structure 38, wherein detents 46 face one another within theinterior cavity. Although structure 38 is illustrated as being coupledto circuit board 22, while coupling structures 40 are illustrated asbeing coupled to electronic component 26, structure 38 may alternativelybe coupled to electronic component 26 while coupling structures 40 arecoupled to circuit board 22.

FIG. 2 schematically illustrates circuit board assembly 120, a firstalternative embodiment of circuit board assembly 20. Circuit boardassembly 120 is substantially identical to circuit board assembly 20except that circuit board assembly 120 includes electronic componentsupport system 132 in lieu of electronic component support system 32.Those remaining elements of assembly 120 which correspond to elements ofassembly 20 are numbered similarly. Like support system 32, supportsystem 132 utilizes detents and projections to adjustably secure andretain electronic component 26 relative to circuit board 22 in bothdirections along axis 42. However, support system 132 achieves thisfunction with relatively fewer and less expensive components as comparedto system 32. System 132 includes support structure 54, supportstructure 56 and intermediate coupling structure 58. Support structure54 comprises a structural member coupled to circuit board 22 andretained against linear movement in both directions along axis 42relative to circuit board 22. In the particular embodiment illustrated,structure 54 is indirectly coupled to circuit board 22 by frame 24.Structure 54 is coupled to coupling structure 58 to retain couplingstructure 58 against linear movement in both directions along axis 42.Support structure 54 is coupled to coupling structure 58 so as to permitcoupling structure 58 to rotate about axis 42.

Support structure 56 comprises a structural member coupled to electroniccomponent 26 and retained against linear movement in both directionsalong axis 42 relative to electronic component 26. Structure 56 iscoupled to coupling structure 58 to retain coupling structure 58 againstlinear movement in both directions along axis 42. Support structure 56is coupled to coupling structure 58 so as to permit coupling structure58 to rotate about axis 42.

Coupling structure 58 in combination with structure 56, component 26 andconnector portion 30 form an electronic component mounting unit 149 forbeing mounted to circuit board 22. Coupling structure 58 comprises amember extending between structures 54 and 56 and configured to beadjusted relative to at least one of structures 54 and 56 along axis 42by being rotated about axis 42. Coupling structure 58 is not adjustablealong axis 42 by direct linear movement in either direction along axis42. In the particular embodiment illustrated, coupling structure 58includes a first externally threaded portion which is screwed to asecond internally threaded portion provided by one of structures 54 and56. As a result, rotation of structure 58 about axis 42 moves the malethreads (projections) of structure 58 within the female threads(detents) of one of structures 54 and 56 to accommodate differentsprings between the electronic component 26 and circuit board 22 due tovarying tolerances of other structures connecting component 26 andcircuit board 22. Rotation of structure 58 moves the male threadsbetween a detent engaging position in which the male threads arereceived within a particular set or portion of female threads and awithdrawn position in which the male threads are removed from at least aportion of the particular set of female threads.

In one embodiment, both structures 54 and 56 include internally threadedportions which are both screwed to the externally threaded portion ofstructure 58. In an alternative embodiment, one of structures 54 and 56includes an internally threaded portion screwed to the externallythreaded portion of structure 58 while the other of structures 54 and 56merely captures or otherwise retains an end portion of structure 58 soas to permit structure 58 to rotate about axis 42 while retainingstructure 58 against linear movement in either direction along axis 42.In one embodiment, coupling structure 58 extends into but not througheither or both of structures 54 and 56. In another embodiment, couplingstructure 58 passes through one or both of structures 54, 56. In oneembodiment, an external threaded portion of coupling structure 58continuously extends along the entire length of structure 58 along axis42. In another embodiment, the externally threaded portion of structure58 includes a plurality of threaded areas spaced along axis 42. Althoughcoupling structure 58 is illustrated as having an external threadedportion, while one or both of structures 54, 56 have internal threadedportions, coupling structure 58 may alternatively have an internalthreaded portion or an internally threaded bore while one or both ofstructures 56 alternatively have an external threaded portion. Forexample, structure 54 may alternatively be configured to be screwed intoan internally threaded bore of structure 58.

FIG. 3 schematically illustrates computing device 202 incorporatingcircuit board assembly 220, a second alternative embodiment of thecircuit board assembly shown in FIG. 1. Computing device 202 (shown as aserver) generally includes baseboard 204, input/output 206, memory 208and processor system 210. Base board 204 connects input/output 206,memory 208 and processor system 210 and serves as an electronic highwaybetween such units. Input/output 206 generally comprises an input/outputboard coupled to baseboard 204. The input/output board generallysupports a plurality of input/output cards. Input/output 206 facilitatesthe use of additional peripherals such as tape drives, DVDs and the likewith computing device 202.

Memory 208 is coupled to baseboard 204 and provides additional memorystorage for computing device 202. In the particular embodiment shown,memory 208 comprises two memory extenders comprising boards carrying aplurality of memory cards.

Processor system 210 does much of the computing or calculations forcomputing device 202 and generally includes a processor board or circuitboard 222, a plurality of processor components 226 and a control 212(known as a computer electronic control or CEC). Circuit board 222generally comprises a conventionally known or future developed circuitboard (also known as a printed circuit assembly) capable of serving asan interface between the various elements connected to circuit board222. Circuit board 222 is coupled to baseboard 204 and electronicallyconnects each of processor components 226 to control 212. In theschematic depiction, circuit board 22 may extend either parallel orperpendicular to base board 204.

Control 212 serves as a traffic cop between each of the processorcomponents 226 and memory 208. Although not shown, computing device 202may additionally include a power supply for supplying power to each ofthe components, one or more cooling fans and a housing for enclosing andsupporting each of the components. Overall, input/output 206, memory 208and processor system 210 cooperate with one another to provideinformation retrieval and processing.

FIGS. 4–9 illustrate circuit board assembly 220 incorporated as part ofprocessor system 210. As best shown by FIGS. 4 and 5, circuit boardassembly 220 includes circuit board 222, frame 224, processor component226, connector portion 228, connector portion 230, and component supportsystem 232. Circuit board 222 is generally described above with respectto FIG. 3. However, in the particular embodiment illustrated in FIGS. 5and 6 in which circuit board 222 is incorporated as part of processorsystem 210, circuit board 222 is specifically configured to be coupledto four processor components 226 with two processor components 226 on afirst side of circuit board 222 and two processor components 226 on asecond opposite side of circuit board 222. For ease of illustration,only a single processor component 226 is shown. In alternativeembodiments, circuit board 222 may be configured to be connected to afewer or greater number of processor components 226.

Frame 224 generally comprises a relatively rigid structure extendingabout a perimeter of circuit board 222 along both faces of circuit board222. In the particular embodiment illustrated, frame 224 is formed fromsheet metal. In alternative embodiments, frame 224 may be formed fromother materials and may be cast. In alternative embodiments, frame 224may have a variety of alternative shapes and configurations dependingupon the support requirements of circuit board 222.

Processor component 226 is configured to be releasably mounted tocircuit board 222 and generally includes processor assembly 234, heatsink assembly 236 and power supply 237. Processor assembly 234 includesa conventionally known or future developed integrated circuit chip (notshown) configured to process information provided to it through circuitboard 222. The circuit chip is mounted upon a circuit board 260 by whichthe chip is connected to connector portion 230.

Heat sink assembly 236 includes heat sink 262 and heat sink mountingmembers 264. Heat sink 262 generally comprises a structure thermallycoupled to integrated circuit chip of processor assembly 234 and alsothermally coupled to power supply 237 to dissipate heat generated byprocessor assembly 234 and by power supply 237. In the embodiment shown,heat sink 262 is adjacent the circuit chip and power supply 237.

Mounting members 264 generally comprise projections or members extendingfrom heat sink 262 about connector portion 230. Mounting members 264include threaded portions that are screwed into brackets 266 which aresecured to frame 224 and which extend about connector portion 228. Inalternative embodiments, mounting members 264 may be screwed tostandoffs or other structures. In the particular embodiment illustrated,heat sink assembly 236 includes four mounting members 264 located ateach corner of connector portion 230. One example of a mounting member264 (also known as a mounting portion) is described in co-pending U.S.patent application Ser. No. 10/661,433 filed on Sep. 12, 2003 by GregoryS. Meyer and Alisa C. Sandoval, and entitled “Circuit Board Assembly,”the full disclosure of which is hereby incorporated by reference.

Power supply 237 comprises a conventionally known or future developeddevice configured to transmit power to processor assembly 234. Powersupply 237 is secured adjacent to heat sink 262 generally between heatsink 262 and circuit board 222. Power supply 237 is connected to circuitboard 222 by cabling 270. Because power supply 237 is generallysuspended above circuit board 222, the weight of power supply 237 and anadjacent portion of heat sink 262 are generally suspended orcantilevered with respect to circuit board 222. As will be described ingreater detail hereafter, support system 232 supports this cantileveredmass relative to circuit board 222 to minimize pivoting of connectorportions 228 and 230 about the resulting fulcrum and to avoid potentialdamage to connector portions 228 and 230. In alternative applications,power supply 237 may be provided by a separate component coupled tocircuit board 22, wherein system 32 supports a cantilevered mass of heatsink 262.

Connector portions 228 and 230 are configured to interact with oneanother to connect processor assembly 234 to circuit board 222 and tofacilitate the transmission of signals therebetween. Connector portion228 is coupled to circuit board 222 and includes a plurality of sockets.Connector portion 226 is coupled to component 226 and includes aplurality of pins which are received within the plurality of sockets ofconnector portion 228. In the particular embodiment illustrated,connector portions 228 and 230 comprise a conventionally knownzero-in-force (ZIF) connector sold by Tyco and Foxcom for use with Intelprocessors. In alternative embodiments, connector portions 228 and 230may comprise other conventionally known or future developed connectiondevices configured to facilitate the transmission of signals betweencircuit board 222 and processor assembly 234.

FIGS. 6–9 illustrate portions of processor component 226 and supportsystem 232 in greater detail. As best shown by FIG. 6, heat sink 262includes platform 272, cooling fins 274, post 276 and brackets 278.Platform 272 generally comprises a structure to which processor assembly234 and power supply 237 are mounted. Platform 272 additionally supportscooling fins 274, posts 276 and brackets 278. Platform 272 may have avariety of sizes and configurations depending upon the size andconfiguration of processor assembly 234 and power supply 237.

Posts 276 extend from platform 272 towards circuit board 222 and frame224. In the particular embodiment illustrated, posts 276 are integrallyformed as part of a single unitary body with platform 272. Inalternative embodiments, posts 276 may be mounted, welded, adhered orfastened to platform 272. Posts 276 interact with and receive portionsof support system 232. In particular, each post 276 includes a pair ofopenings 280 which interact with portions of a support system 232 toprevent complete rotation of those portions of support system 232.

Cooling fins 274 are coupled to platform 272 and extend generallyopposite to processor assembly 234 and power supply 237. Cooling fins262 provide an enlarged surface area for the dissipation of heat.

Brackets 278 extend along opposite edges of platform 272 and areconfigured to interact with portions of support system 232. Inparticular, each bracket 278 includes a pair of aligned openings 282through which portions of support system 232 extend. In addition,brackets 278 include opposing surfaces 284, 286 which capture and retainother portions of support system 232 as will be described in greaterdetail hereafter.

Support system 232 supports the cantilevered mass of electroniccomponent 226 relative to circuit board 222 to prevent damage toconnector portions 228 and 230. Support system 232 includes two supportassemblies 290 generally located in the corners of an end of electroniccomponent 226 most distant from connector portion 230. FIG. 7illustrates a single support assembly 290 and interacting portions ofheat sink 262 in greater detail. As best shown by FIG. 7, supportassembly 290 includes support structure 254, support structure 256 andintermediate coupling structure 258. Support structure 254 generallycomprises a structure that is configured to be coupled to circuit board222 so as to be retained against linear movement in both directionsalong axis 242. Structure 254 is further configured to be coupled tocircuit board 222 so as to be retained against rotation about axis 242.Support 254 is further configured to interact with coupling structure258 so as to retain coupling structure 258 against linear movementrelative to circuit board 222 along axis 242. In the particularembodiment illustrated, support structure 254 includes an internallythreaded bore 294 providing a threaded portion configured to threadablyengage portions of structure 258. In the particular embodimentillustrated, structure 254 comprises a conventionally known nut, such asa PEM threaded fastener sold by Pen Engineering, pressed into frame 224and extending towards heat sink 262.

Support structure 256 comprises a structure configured to be coupled toelectronic component 26 so as to be retained against linear movement inboth directions along axis 242. At the same time, structure 256 isconfigured to be coupled to an electronic component 226 so as to bemovable relative to electronic component 226 in at least one directionperpendicular to axis 242. Structure 256 is further configured to becoupled to coupling structure 258 so as to retain coupling structure 258against linear movement relative to structure 256 and relative toelectronic component 226 in both directions along axis 242. In theparticular embodiment illustrated, coupling structure 256 includes body300, cap 302, groove 304, wings 306 and internally threaded bore 308.

Body 300 defines groove 304 and internally threaded bore 308 and extendsthrough passage 310 formed within post 276 of heat sink 262. Body 300 isdimensioned smaller than passage 310 to facilitate movement of body 300within passage 310 in a direction perpendicular to axis 242. In theembodiment illustrated, body 300 is dimensioned smaller than passage 310by a distance sufficient to allow adequate movement of body 300 toaccommodate manufacturing variations. At the same time, body 300 is notdimensioned smaller than passage 310 by such a large distance thatsupport structure 258, when passed through body 300, may completely missbore 294 when component 226 is being mounted to circuit board 222. Inone embodiment, the interior of passage 310 and the exterior surfaces ofbody 300 are spaced from one another by an annular gap having a radialwidth of between about 0.3 mm to 0.9 mm (a total gap of 0.6 mm to 1.8mm). In the particular embodiment illustrated, passage 310 is spacedfrom the exterior of body 300 by an annular gap having a radial width ofapproximately 0.5 mm. In the particular embodiment illustrated, bothbody 300 and passage 310 are cylindrical in shape. In alternativeembodiments, body 300 and passage 310 may have other shapes.

Cap 302 and groove 304 are generally located proximate to opposite endsof body 300 and are configured to engage post 276 to retain body 300against linear movement in both directions along axis 242. As best shownby FIGS. 7A and 9, cap 302 is coupled to body 300 and abuts axiallyfacing surface 312 of post 276 to retain body 300 against linearmovement along axis 242 in the direction indicated by arrow 313. Asshown by FIGS. 8 and 9, groove 304 receives a snap ring 316, such as anE-ring, which extends beyond passage 310 so as to abut the oppositeaxially facing surface 317 of post 376 to retain body 300 against linearmovement along axis 242 in the direction indicated by arrow 319.

Although body 300 is illustrated as being retained against linearmovement along axis 242 in both directions by cap 302, groove 304 andsnap ring 316, body 300 may alternatively be coupled to electroniccomponent 226 so as to be retained against linear movement in bothdirections along axis 242 by other retaining mechanisms. For example, inlieu of cap 302 being integrally formed as part of a single unitary bodyof body 300, cap 302 may alternatively be welded, bonded or fastened tobody 300. Cap 302 may be releasably coupled to body 300. For example,cap 302 may comprise a snap ring releasably fastened to body 300. Insuch applications where cap 302 is releasably connected to body 300,snap ring 316 may be replaced with cap or radially extending projectionintegrally formed as part of body 300 or permanently coupled to body300. In alternative embodiments, body 300 may be provided with one ormore axially facing surfaces which are abutted by an opposite shoulderor axially facing surface extending within passage 310 from post 376 orby a snap ring or similar structure releasably coupled to post 276within an annular groove formed along passage 310.

As best shown by FIGS. 7A and 8, wings 306 extend from body 300 and areconfigured to be received within openings 280 of post 276. Wings 306engage one of edge surfaces 322 of opening 280 during initial rotationto prevent complete rotation about axis 242. Edge surfaces 322 aregenerally spaced from one another and spaced from wings 306 by adistance sufficient to permit body 300 to move in a directionperpendicular to axis 242 within passage 310. To facilitate sufficientmovement of body 300 within passage 310, opposing edge surfaces 322 ofopenings 280 are spaced from one another by a distance D at least theamount of gap G (at least 0.3 mm to 0.9 mm). In the particularembodiment illustrated, edge surfaces 322 are spaced from the oppositeedges of wings 306 to permit rotation of body 300 by approximately 10degrees. Because wings 306 prevent body 300 from completely rotatingabout axis 242, structure 258 may be screwed into internally threadedbore 308.

In alternative embodiments, other structures may be employed to key orretain body 300 against complete rotation about axis 242. For example,body 300 and passage 310 may be provided with non-symmetricalcross-sectional shapes such as oval or D-shape.

Interior threaded bore 308 extends through body 300, between wings 306and through cap 302. As shown by FIG. 9, portions of bore 308 areinternally threaded for being screwed to coupling structure 258. Inalternative embodiments, the entirety of bore 308 may be internallythreaded or bore 308 may be provided with spaced threaded areas alongits interior.

Coupling structure 258 in combination with structure 256, component 226and connector portion 230 form an electronic component mounting unit 249for mounting to circuit board 222 and its connector portion 228.Coupling structure 258 cooperates with structure 256 to form a floatingcoupler 259 for coupling an electronic component, such as component 226,to a circuit board, such as circuit board 222. Coupling structure 258interacts with both support structure 254 and support structure 256 tocouple electronic component 226 to circuit board 222 and to preciselyretain component 226 relative to circuit board 222 along axis 242 duringvibration and loading. Structure 258 generally includes shank portion326, head portion 328 and annular groove 330. Shank portion 326 has alength sufficient so as to extend through bore 308 of body 300 and intobore 294 of support structure 254. Shank portion 326 includes anexternally threaded portion 332 extending along at least a part of itslength. In alternative embodiments, threaded portion 332 may extendalong the entire length of shank portion 326 or may be intermittentlyspaced along the length of shank portion 326.

Shank portion 326 additionally includes a tapered end portion 333. Tapedend portion 333 engages structure 254 to assist in aligning structure258 with bore 294. As structure 258 is moved along axis 242 towards bore294, tapered end portion 333 engages the lip or mouth of bore 294. Dueto its tapered, sloped or ramped surface, engagement of end portion 333with the lip or mouth of bore 294 moves structure 258 and structure 256in a direction perpendicular to axis 242 as structure 258 is moved alongaxis 242 towards structure 254. This automatic alignment of structure258 with bore 294 along axis 242 facilitates easier mounting ofcomponent 226 to circuit board 222. In alternative embodiments, themouth of bore 294 may be funnel-shaped to provide such automaticalignment. In still other embodiments, end portion 333 may omit suchtapering, requiring iterative movement of structure 258 to alignstructure 258 with bore 294.

Head portion 328 extends from shank portion 326 and is generally largerthan shank portion 326 so as to form a shoulder 336. Shoulder 336 isdimensioned so as to bear against a washer 338 which bears againstsurface 284 of bracket 278. Shoulder 336 and washer 338 cooperate withsurface 284 to limit movement of structure 258 along axis 242.

Groove 330 is formed within head portion 328 and configured to receive asnap ring 340, such an E-ring. Snap ring 340 extends beyond the upperopening 282 shown in FIG. 7 to retain coupling structure 258 relative tobracket 278 once coupling structure 258 is inserted through openings282. As a result, coupling structure 258 may be coupled or mounted tocomponent 226 to form mounting unit 249 prior to being mounted tocircuit board 222. In alternative embodiments, groove 330 and snap ring340 may be omitted.

As best shown by FIGS. 8 and 9, support assembly 290 is assembled byinserting structure 256 into passage 310 with wing 306 positioned withinopenings 280. Once grooves 304 are positioned beyond surface 317 of heatsink 262, snap ring 316 is positioned within groove 304 to axiallyretain structure 256 along axis 242. Washer 338 is aligned with andbetween openings 282. Coupling structure 258 is inserted through washer338 and through openings 282. Snap ring 340 is then secured withingroove 330. According to one method, coupling structure 258 is insertedthrough washer 338 and through openings 282 and snap ring 340 isinserted within groove 330 during the manufacture and assembly ofcomponent 226 and mounting unit 249 even prior to the insertion ofstructure 256 into passage 310. According to yet alternative methods,the insertion of snap ring 340 into groove 330 may be omitted.

Coupling structure 258 is rotated about axis 242 to screw threadedportion 332 into the threaded portion provided by interior threaded bore308. Body 300 is moved in a direction perpendicular to axis 242 so as toalign bore 308 with bore 294. In the particular embodiment shown, thepoint of structure 258 engages structure 256 to automatically line upbores 308 and 294 along axis 242. Once bores 308 and 294 have beenproperly aligned, coupling structure 258 is further rotated so as toscrew threaded portion 332 into threaded bore 294 of support structure254. Coupling structure 258 is rotated in either direction about axis242 to appropriately position processor component 226 relative tocircuit board 222 in the direction along axis 242 so as to reduceloading upon connector portions 228 and 230 so as to reduce thepossibility of accidental damage to connector portions 228 and 230.Coupling structure 258 accommodates varying established positions at theprocessor component 226 with respect to the circuit board 222 dependingupon the pitch (approximately m 3×0.5 mm) of threaded portion 332. Atthe same time, the inter-engagement of threaded portions 332 of thethreaded portion of bore 308 and of the threaded portion of bore 294retain processor component 226 relative to circuit board 222 and againstlinear movement in both directions along axis 242. In the particularembodiment shown, structures 258 are generally of equal or greaterstrength than mounting members 264. Thus, no special attention isrequired during torquing structures 258. The same procedure is repeatedfor the other support assembly 290.

In lieu of inserting coupling structure 258 into support structure 256and then moving support structure 256 in a direction perpendicular toaxis 242 to align bore 308 with bore 294, body 300 may be moved in adirection perpendicular to axis 242 to align bores 308 and 294 prior toinsertion of coupling structure 258. Although support assembly 290 isillustrated as including washer 338, snap ring 340 and spring 342 whichinteract with bracket 278, such elements, as well as brackets 278, maybe omitted. In other embodiments, washer 338 may be omitted where headportion 328 is larger relative to opening 282.

The overall process of mounting processor component 226 to circuit board222 is as follows. Connector portion 230 is first connected to connectorportion 228. In the particular embodiment illustrated, the pins ofconnector portion 230 are inserted into the corresponding sockets ofconnector portion 228. The connection of connector portion 230 andconnector portion 228 further involves actuation of interconnect leverto shift the pins within the sockets as conventionally known withrespect to ZIF connectors. Each of mounting members 264 are then securedto brackets 266. In the particular embodiment illustrated, mountingmembers 264 comprise screws which are tightened to control a clampingforce provided by load springs 265 (shown in FIG. 4) and to set thespacing between component 226 and circuit board 222 (the “Z-axis”height). Thereafter, both support assemblies 290 are mounted relative tocircuit board 222 as described above to support the cantilevered mass ofcomponent 226.

Although support system 232 is illustrated as having a floating couplingstructure 256 movably coupled to electronic component 226, system 232may alternatively have a floating structure movably coupled to frame 224or to circuit board 222. For example, in one alternative embodiment,support structure 254 and coupling structure 256 may be replaced with aconventionally known floating fastener, such as PEM AS or AC seriesfastener sold by Pen Engineering, 5190 Old Easton Road, Danboro, Pa.18916. With such an alternative embodiment, component 226 is providedwith an internally threaded structure stationarily secured to electroniccomponent 226 so as to be retained in both directions along axis 242.Support structure 258 is threaded through the internally threadedstructure coupled to electronic component 226 and further threaded intothe floating portion of the PEM floating fastener coupled to circuitboard 222 and retained in both directions along axis 242. Although suchan alternative embodiment would be more prone to cross threading andmisalignment since structure 258 would be locked in place so as to missthe floating second hole and although such floating PEM fasteners tendto take up much more space on frame 224, this alternative embodimentwould still provide some flexibility for accommodating manufacturingvariations and tolerance stack.

Although the present invention has been described with reference toexample embodiments, workers skilled in the art will recognize thatchanges may be made in form and detail without departing from the spiritand scope of the invention. For example, although different exampleembodiments may have been described as including one or more featuresproviding one or more benefits, it is contemplated that the describedfeatures may be interchanged with one another or alternatively becombined with one another in the described example embodiments or inother alternative embodiments. Because the technology of the presentinvention is relatively complex, not all changes in the technology areforeseeable. The present invention described with reference to theexample embodiments and set forth in the following claims is manifestlyintended to be as broad as possible. For example, unless specificallyotherwise noted, the claims reciting a single particular element alsoencompass a plurality of such particular elements.

1. A circuit board assembly comprising: a circuit board; an electroniccomponent; a plurality of incremental detents coupled to one of thecircuit board and electronic component and retained relative to said oneof the circuit board and electronic component against linear movement inboth directions along a first axis; and at least one projection coupledto the other of the circuit board and the electronic component andretained relative to the other of the circuit board and the electroniccomponent against linear movement along the first axis, wherein the atleast one projection is configured to be selectively received within atleast a selected one of the plurality of detents to adjust and retain aspacing of the electronic component relative to the circuit board alongthe first axis.
 2. The circuit board assembly of claim 1, wherein thefirst plurality of incremental detents is provided by a first threadedportion and wherein the at least one first projection is provided by asecond threaded portion screwed to the first threaded portion.
 3. Thecircuit board assembly of claim 2 including a first intermediatestructure having the first threaded portion and rotatably coupled tosaid one of the circuit board assembly and the electronic componentwhile retained against linear movement in both directions along thefirst axis.
 4. The circuit board assembly of claim 3 including a thirdthreaded portion coupled to said one of the circuit board assembly andthe electronic component against linear movement in both directionsalong the first axis, wherein the third threaded portion is screwed tothe first threaded portion to retain the first intermediate structureand the first threaded portion against linear movement in bothdirections along the first axis.
 5. The circuit board assembly of claim4, wherein the third threaded portion is releasably coupled to said oneof the circuit board assembly and the electronic component.
 6. Thecircuit board assembly of claim 4 including: a second intermediatemember extending along a second axis and including a fourth threadedportion; a fifth threaded portion coupled to one of the circuit boardassembly and the electronic component and retained against linearmovement in both directions along the second axis, the fifth threadedportion being screwed to the fourth threaded portion; and a sixththreaded portion coupled to the other of the circuit board assembly andthe electronic component and retained against linear movement in bothdirections along the second axis, the sixth threaded portion beingscrewed to the fourth threaded portion.
 7. The circuit board assembly ofclaim 6, wherein the fifth threaded portion is releasably coupled tosaid one of the circuit board assembly and the electronic component. 8.The circuit board assembly of claim 4 including: a processor assembly; aheat sink coupled to the processor assembly; and a first connectorportion coupled to the processor assembly, wherein the circuit boardassembly further includes a second connector portion coupled to thecircuit board assembly and releasably connected to the first connectorportion.
 9. The circuit board assembly of claim 8 including a powersupply configured to supply power to the processor assembly and having amass cantilevered relative to the circuit board, wherein the firstthreaded portion, the second portion and the third threaded portioncooperate to support the cantilevered mass relative to the circuitboard.
 10. The circuit board assembly of claim 8, wherein the firstconnector portion includes one of a plurality of pins and wherein thesecond connector portion includes the other of a plurality of socketsremovably receiving the plurality of pins.
 11. The circuit boardassembly of claim 8, wherein the third threaded portion is coupled tothe heat sink.
 12. The circuit board assembly of claim 11, wherein theheat sink includes a post incorporating the third threaded portion. 13.The circuit board assembly of claim 11 including: a second intermediatestructure extending along a second axis and having a fourth threadedportion; a fifth threaded portion coupled to the heat sink and retainedagainst linear movement in both directions along the second axis, thefifth threaded portion screwed to the fourth threaded portion; and asixth threaded portion coupled to the circuit board assembly andretained against linear movement in both directions along the secondaxis, the sixth threaded portion being screwed to the fourth threadedportion.
 14. The circuit board assembly of claim 13, wherein the firstintermediate structure and the second intermediate structure are locatedon a first side of the processor assembly and wherein the circuit boardassembly further includes: a first plurality of mounting memberscoupling the circuit board assembly to the heat sink on a secondopposite side of the processor assembly.
 15. The circuit board assemblyof claim 14 including a second plurality of mounting members couplingthe circuit board assembly to the heat sink, the second plurality ofmounting members being located between the processor assembly and thefirst and intermediate members.
 16. The circuit board assembly of claim15, wherein the first plurality of mounting members and the secondplurality of mounting members load the first connector portion intoconnection with the second connector portion.
 17. The circuit boardassembly of claim 4, wherein the electronic component includes a postincluding the third threaded portion.
 18. The circuit board assembly ofclaim 17, wherein the third threaded portion is releasably coupled tothe post.
 19. The circuit board assembly of claim 1, wherein theelectronic component includes a power supply having a mass cantileveredrelative to the circuit board, wherein the plurality of incrementaldetents and the at least one projection cooperate to support thecantilevered mass relative to the circuit board.
 20. An electroniccomponent mounting unit for use with a circuit board, a first threadedportion coupled to the circuit board and an intermediate structurehaving a second threaded portion screwed to the first threaded portionalong an axis, the unit comprising: an electronic component; and a thirdthreaded portion coupled to the electronic component, wherein the thirdthreaded portion is configured to be screwed to the second threadedportion to retain the electronic component relative to the circuit boardin both directions along the axis.
 21. The unit of claim 20, wherein theelectronic component includes a heat sink.
 22. The unit of claim 21,wherein the third threaded portion is coupled to the heat sink.
 23. Theunit of claim 22, wherein the third threaded portion is removablycoupled to the heat sink.
 24. The unit of claim 21, wherein the circuitboard includes a first connector portion and wherein the electroniccomponent includes a processor assembly coupled to the heat sink andincluding a second connector portion configured to connect to the firstconnector portion.
 25. A computing device comprising: a baseboard; amemory coupled to the baseboard; input/output coupled to the baseboard;and a processor system coupled to the baseboard, the processor systemincluding: a frame; a circuit board; and a processor componentincluding: a processor assembly; and a heat sink coupled to theprocessor assembly; a plurality of incremental detents coupled to one ofthe processor component and the circuit board and retained againstlinear movement in both directions along an axis extending perpendicularfrom the circuit board; and at least one projection coupled to the otherof the circuit board and the electronic component and retained againstlinear movement in both directions along the axis, wherein the at leastone projection is received within at least one of the plurality ofdetents to retain the electronic component relative to the circuit boardagainst movement in both directions along the axis.
 26. The device ofclaim 25, wherein the first plurality of incremental detents comprises afirst threaded portion and wherein the at least one first projectioncomprises a second threaded portion screwed to the first threadedportion.
 27. The device of claim 26 including an intermediate structurehaving the first threaded portion and rotatably coupled to said one ofthe circuit board and the electronic component while being retainedagainst linear movement in both directions along the axis.
 28. Thedevice of claim 27 including a third threaded portion coupled to saidone of the circuit board and the electronic component against linearmovement in both directions along the axis, wherein the third threadedportion is screwed to the first threaded portion to retain theintermediate structure and the first threaded portion against linearmovement in both directions along the axis.
 29. The device of claim 28,wherein the third threaded portion is releasably coupled to said one ofthe circuit board and the electronic component.
 30. A circuit boardassembly comprising: a circuit board; an electronic component; and meansfor adjustably positioning the electronic component in one of aplurality of positions relative to the circuit board in both directionsalong an axis substantially perpendicular to the circuit board andmaintaining the electronic component in said one of the plurality ofpositions relative to the circuit board against linear movement in bothdirections along the axis.
 31. A circuit board assembly comprising: acircuit board; an electronic component; a first threaded portion coupledto the electronic component so as to be retained in both directionsalong an axis relative to the electronic component; a second threadedportion coupled to the circuit board; and an intermediate structurealong the axis having a third threaded portion screwed to the firstthreaded portion and screwed to the second threaded portion.
 32. Theassembly of claim 31, wherein the first threaded portion comprises afirst internally threaded bore, wherein the second threaded portioncomprises a second internally threaded bore and wherein the thirdthreaded portion of the intermediate structure is screwed into the firstthreaded bore and into the second threaded bore.
 33. A method formounting an electronic component to a circuit board, the methodcomprising: positioning at least one projection, coupled to one of theelectronic component and the circuit board and retained against linearmovement along an axis perpendicular to the circuit board, within atleast one of a plurality of incremental detents, extending along theaxis and coupled to the other of the circuit board and the electroniccomponent and retained against linear movement in both directions alongthe axis; and repositioning the at least one projection and the at leastone incremental detent relative to one another to adjust a spacingbetween the electronic component and the circuit board.
 34. The methodof claim 33, wherein the plurality of incremental detents are providedby a first threaded portion and wherein the at least one projection isprovided by a second threaded portion and wherein the inserting stepincludes screwing the first threaded portion to the second threadedportion.
 35. The method of claim 34, wherein said one of the circuitboard and the electronic component includes a third threaded portion,wherein the first portion is provided by an intermediate structure andwherein the method further includes the step of screwing the firstthreaded portion to the third threaded portion.
 36. The method of claim33, wherein the electronic component includes a processor assembly and aheat sink coupled to the processor assembly and wherein the methodfurther includes connecting the processor assembly to the circuit board.37. The method of claim 36 further including securing a plurality ofmounting members between the electronic component and the circuit boardabout the processor assembly.
 38. The unit of claim 20, wherein thethird threaded portion is configured to facilitate adjustable spacing ofthe component relative to the circuit board in both directions along theaxis.
 39. A circuit board assembly comprising: a circuit board; anelectronic component; a plurality of incremental detents coupled to oneof the circuit board and electronic component and retained relative tosaid one of the circuit board and electronic component against linearmovement in both directions along a first axis; at least one projectioncoupled to the other of the circuit board and the electronic componentand retained against linear movement along the first axis, wherein theat least one projection is received within at least one of the pluralityof detents to retain the electronic component relative to the circuitboard against linear movement in both directions along the first axis,wherein the first plurality of incremental detents is provided by afirst threaded portion and wherein the at least one first projection isprovided by a second threaded portion screwed to the first threadedportion; a first intermediate structure having the first threadedportion and rotatably coupled to said one of the circuit board assemblyand the electronic component while retained against linear movement inboth directions along the first axis; and wherein the electroniccomponent includes a post including a third threaded portion, whereinthe third threaded portion is screwed to the first threaded portion toretain the first intermediate structure and the first threaded portionagainst linear movement in both directions along the first axis.
 40. Acircuit board assembly comprising: a circuit board; an electroniccomponent; a plurality of incremental detents coupled to one of thecircuit board and electronic component and retained relative to said oneof the circuit board and electronic component against linear movement inboth directions along a first axis; and at least one projection coupledto the other of the circuit board and the electronic component andretained against linear movement along the first axis, wherein the atleast one projection is received within at least one of the plurality ofdetents to retain the electronic component relative to the circuit boardagainst linear movement in both directions along the first axis, whereinthe electronic component includes a power supply having a masscantilevered relative to the circuit board, wherein the plurality ofincremental detents and the at least one projection cooperate to supportthe cantilevered mass relative to the circuit board.